Performance Characteristics
Suitable for inner layer and outer layer dry film pretreatment
It can clean the copper surface, roughen the copper surface more than ordinary micro etchant, and improve the yield of fine circuit
The etch rate of copper surface is stable,when Ra=0.2-0.25um, Rz=2.0-2.5um，S/A=1.8-2.0,the micro etching amount is 0.5um-1.2um
The working tank liquid can withstand 20ppm chloride ion
Wastewater treatment is easy
Treatment effect
Comparison of appearance between medium roughing and ordinary micro etching
The appearance of ordinary micro etching and medium roughing micro etching is compared, and the amount of micro etching is 1um. On the left is the appearance of ordinary micro etching, which is the color of copper surface; On the right is the medium roughed appearance, and the copper surface is red.
Comparison of morphology between ordinary micro etching and medium roughing chemical solution treatment
Under the same micro etching amount of 1.0um, the morphology of ordinary micro etching and medium roughening micro etching is compared. On the left is ordinary micro erosion, with roughness Ra of 0.17um and RZ of 2.0um; On the right is medium roughening, and the medium roughening has a roughener surface, with RA of about 0.28um and RZ of about 2.7um.
SCAN