Performance characteristics
It is suitable for semi-additive process flow, and can complete film stripping of lines with line width spacing of more than 16 µm/ 16 µm
It is also applicable to the removal of secondary dry film after selective nickel gold deposition, and has no attack on gold surface and solder resist layer
The strip time of dry film is short. The strip time of ordinary dry film (such as Asahi Huacheng yq40) can be completed in 30-40 seconds, and that of secondary dry film can be completed in 90-100 seconds
Strong compatibility, without any change to the material of the equipment
The installation of filter will effectively reduce the consumption
Treatment effect
Adhesive: bond other components into a whole
Photoinitiator: during exposure, the photoinitiator in the illuminated area is activated to initiate polymerization of the monomer in this part
Monomer: the unpolymerized monomer is soluble in the developer, while the polymerization is insoluble in the developer
Plasticizer: increase the fluidity of dry film when pasting film
Adhesion promoter: increase the adhesion between dry film and copper foil
Dye: discoloration after exposure to facilitate the inspection of dry film image
Comparison of film fragmentation of different film removers
Due to the different working mechanism of film removal, the size of dry film fragments removed by organic film removal solution is smaller than that removed by NaOH
SCAN